Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net
  • Sellerwebpaste.co
  • List PriceUS$4.86piece
  • Sale PriceUS$4.86piece
  • ShippingFree Shipping
  • Ratings4,1 (513)

Product Description

Features:
Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 6s Plus, 6s
Function: Repairing or fixing problem of iphone 6s Plus 6s processor
Package includes:
1 x BGA Reballing Stencils for iPhone 6s/6SP
Details pictures:


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net


Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering Net

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